发明名称 THERMOELECTRIC DEVICES USING SINTERED BONDING
摘要 A device for conducting heat from a source to a sink is provided that, in one embodiment, includes a thermoelectric element coupled to a substrate via sintered material that includes nano and/or micro particles. In one aspect, the sintered material includes silver particles and in another aspect the sintered material also includes an additive to control the coefficient of thermal expansion of the sintered material.
申请公布号 WO2013116107(A1) 申请公布日期 2013.08.08
申请号 WO2013US23203 申请日期 2013.01.25
申请人 BAKER HUGHES INCORPORATED;KAHLER, JULIAN;KRUSPE, THOMAS;JUNG, SEBASTIAN;STRANZ, ANDREJ;WAAG, ANDREAS;PEINER, ERWIN 发明人 KAHLER, JULIAN;KRUSPE, THOMAS;JUNG, SEBASTIAN;STRANZ, ANDREJ;WAAG, ANDREAS;PEINER, ERWIN
分类号 H01L35/02;H01L35/34 主分类号 H01L35/02
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