发明名称 SENSOR OVER-MOLD SHAPE
摘要 An implantable sensor module includes a housing having an inner shell and an outer layer formed to extend over and enclose the inner shell to form an outer wall of the housing, the inner shell having a thickness extending between an inner wall of the inner shell and an outer wall of the inner shell, the outer layer having an inner side engaged against the outer wall of the inner shell and having a thickness extending between the inner side and the outer wall of the housing, wherein the inner shell and the outer layer form a substantially flat portion. A flexible diaphragm is formed within the inner shell and extends between a first edge and a second edge, and a shoulder extends adjacent to the first edge to extend the outer layer laterally away from a central medial line extending between the first and second edges of the diaphragm.
申请公布号 WO2013115899(A1) 申请公布日期 2013.08.08
申请号 WO2012US66171 申请日期 2012.11.21
申请人 MEDTRONIC, INC. 发明人 FLO, DANIEL S.;CARNEY, JAMES K.;MOTHILAL, KAMAL DEEP;SCHELL, JON D.
分类号 A61B5/0215;A61B5/03 主分类号 A61B5/0215
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