发明名称 HIGH-FREQUENCY MODULE
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency module capable of suppressing that stress is applied to a connection position between a high-frequency lead wire and a connection lead wire in an axial direction of the connection lead wire and its vertical direction, by a simple configuration.SOLUTION: In a high-frequency module, high-frequency lead wires 26a and 26b respectively formed to two wiring parts are electrically connected with each other via a connection lead wire 28 and a connection member 30. To the one high-frequency lead wire 26a, the connection lead wire 28 is fixed so as to connect the high-frequency lead wires 26a and 26b with each other at the shortest distance. To the other high-frequency lead wire 26b, the connection member 30 is fixed. To a bottom face of the connection member 30, a recessed part 30a having a height substantially equal to or slightly lower than a height of the connection lead wire 28 and having a width sufficiently larger than a width of the connection lead wire 28 is formed. The connection lead wire 28 is located in a gap between the connection member 30 and the high-frequency lead wire 26b, that is generated by this recessed part 30a.
申请公布号 JP2013152886(A) 申请公布日期 2013.08.08
申请号 JP20120013718 申请日期 2012.01.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKIMI NAOYA
分类号 H01R13/58;H01P5/02 主分类号 H01R13/58
代理机构 代理人
主权项
地址