| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing an optical device wafer capable of suppressing a crack in an uncertain direction of the optical device wafer by releasing a stress of a warpage which occurs in the optical device wafer due to gradual division of the optical device wafer during grinding processing.SOLUTION: A method for dividing an optical device wafer (W) into individual chips along a division schedule line (301) formed on a surface comprises the steps of: forming a plurality of kinds of modified layers (304) having different thicknesses inside the optical device wafer (W) by laser processing; and thinning the optical device wafer (W) to a finish thickness and gradually dividing the optical device wafer along the division schedule line (301) of a modified layer (301) thickly formed due to a grinding load during grinding processing with a modified layer (304) as an origin. |
