DICING SYSTEM AND METHOD

摘要

A singulation system for dicing IC units from a substrate comprising; a block (30) for receiving said substrate (31), said block movable from a substrate receiving station to a dicing station; a first dicing saw (10) for dicing the substrate when at the dicing station; a second dicing saw (15) for dicing the substrate when at the dicing station; wherein the first and second dicing saws are of different varieties so as to perform different dicing functions on said substrate.