SUBSTRATE PROCESSING APPARATUS, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To easily remove by-products etc. remaining in an exhaust part.SOLUTION: A substrate processing apparatus includes: a processing chamber where a substrate is housed; a first gas supply part supplying a first process gas containing predetermined chemical elements to the substrate; a second gas supply part supplying a second process gas containing predetermined chemical elements and halogen to the substrate; an exhaust part exhausting air in the processing chamber; a cleaning gas bypass supply part supplying a cleaning gas to the exhaust part without passing the cleaning gas through the processing chamber; a cleaning monitoring part provided at the exhaust part and detecting the state of the exhaust part; and a control part controlling the cleaning gas supply conducted by the cleaning gas bypass supply part according to the state of the exhaust part detected by the cleaning monitoring part.