SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which stably removes particles on a substrate surface achieving excellent in-plane uniformity.SOLUTION: A process liquid such as DIW is accumulated in a process liquid accumulation tank 1 and a liquid film LF is formed. A pulse signal is output from an ultrasonic oscillator 4 to a vibrator of an ultrasonic head 2 to provide ultrasonic oscillations to the liquid film LF in a state that a substrate W is immersed in the liquid film LF. Further, concurrently, the process liquid is transferred from a process liquid supply source 52 to a droplet supply nozzle 51 by pressure, and the process causes droplets of the process liquid to be dropped from the droplet supply nozzle 51 to a droplet supply position Pd of the liquid film LF. In this way, the provision of the ultrasonic oscillations and the droplet supply are performed to the liquid film LF. Fine bubbles occurring due to the droplet supply spreads from a periphery of a substrate surface Wf to the opposite side of a vibration provision position Pv to remove particles from the substrate surface Wf.