发明名称 DIELECTRIC THIN FILM WITHOUT CRACK ON SURFACE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a dielectric thin film in which a long crack extending on a film surface thereof is not present and which is high in dielectric voltage.SOLUTION: In manufacturing of the dielectric thin film whose composition is composed of BaSrTiO(0≤x≤1, 0.9≤y≤1.1), a precursor of the thin film is coated on a substrate and dried, and then the dried thin film is subjected to main burning at a temperature rising rate of 30°C/min or less, thereby, the dielectric thin film is formed in such a manner that a mean primary particle diameter is 70 nm or more, a continually straight crack of 1.5 μm or more in length is not present on a surface of the thin film, and leakage current density at voltage 5 V is less than 10A/cmor the leakage current density at voltage 20 V is less than 10A/cm.
申请公布号 JP2013153179(A) 申请公布日期 2013.08.08
申请号 JP20130041871 申请日期 2013.03.04
申请人 MITSUBISHI MATERIALS CORP 发明人 FUJII JUN;SAKURAI HIDEAKI;SOYAMA NOBUYUKI
分类号 H01L21/316;H01G4/12;H01G4/33;H01L21/336;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;H01L29/78;H01L41/18;H01L41/187;H01L41/23;H01L41/39;H01L41/43 主分类号 H01L21/316
代理机构 代理人
主权项
地址