SOLDERING APPARATUS AND SOLDERING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a soldering apparatus and a soldering method which stabilize the solder adhesion amount.SOLUTION: A soldering apparatus is used for transferring a printed circuit board 1 to jetted molten solder 2 and immersing the printed circuit board 1 in the molten solder 2 and includes: a jet nozzle 11 having an upper end part defined by a plate member 15 vertically extending and jetting the molten solder 2 so that the molten solder 2 contacts with one surface 15a of the plate member 15; a duct 12 disposed in a transfer direction TD of the printed circuit board 1 relative to the jet nozzle 11, the duct 12 in which the molten solder 2 flows down while contacting with the other surface 15b of the plate member 15; and an inactive gas supply nozzle 13 that is disposed in the transfer direction TD of the printed circuit board 1 relative to the duct 12 and may supply an inactive gas G to the printed circuit board 1.