发明名称 |
Semicondictor Device with Edge Termination and Method for Manufacturing a Semiconductor Device |
摘要 |
According to an embodiment, a semiconductor device includes a semiconductor body having a first semiconductor material and a second semiconductor material having a band gap larger than a band gap of the first semiconductor material. A first pn-junction is formed in the first semiconductor material. A second pn-junction is formed by the second semiconductor material and extends deeper into the semiconductor body than the first pn-junction. The second semiconductor material is in contact with the first semiconductor material and forms part of an edge termination zone of the semiconductor device.
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申请公布号 |
US2013200392(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201213366707 |
申请日期 |
2012.02.06 |
申请人 |
SCHMIDT GERHARD;INFINEON TECHNOLOGIES AUSTRIA AG |
发明人 |
SCHMIDT GERHARD |
分类号 |
H01L29/16;H01L21/20;H01L29/02 |
主分类号 |
H01L29/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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