发明名称 Semicondictor Device with Edge Termination and Method for Manufacturing a Semiconductor Device
摘要 According to an embodiment, a semiconductor device includes a semiconductor body having a first semiconductor material and a second semiconductor material having a band gap larger than a band gap of the first semiconductor material. A first pn-junction is formed in the first semiconductor material. A second pn-junction is formed by the second semiconductor material and extends deeper into the semiconductor body than the first pn-junction. The second semiconductor material is in contact with the first semiconductor material and forms part of an edge termination zone of the semiconductor device.
申请公布号 US2013200392(A1) 申请公布日期 2013.08.08
申请号 US201213366707 申请日期 2012.02.06
申请人 SCHMIDT GERHARD;INFINEON TECHNOLOGIES AUSTRIA AG 发明人 SCHMIDT GERHARD
分类号 H01L29/16;H01L21/20;H01L29/02 主分类号 H01L29/16
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