发明名称 THERMOPLASTIC, SEMICONDUCTIVE COMPOSITIONS
摘要 Crosslinkable, semiconductive, peroxide-free thermoplastic compositions having a stable volume resistivity of less than 1000 ohm-cm comprise, based on the weight of the composition: A. 60-90 wt% silane-functionalized polyethylene; B. 0.5-20 wt% organopolysiloxane containing two or more functional end groups; C. 10-20 wt% high conductivity carbon black, e.g., a carbon black having an average particle size of 50 nm or less, a surface area (BET) of 700-1250 m2/g, and an oil absorption (DBP) of 300-500 ml/100 g; and D. 0.05 - 0.2 wt% crosslinking catalyst.
申请公布号 WO2013116196(A1) 申请公布日期 2013.08.08
申请号 WO2013US23588 申请日期 2013.01.29
申请人 DOW GLOBAL TECHNOLOGIES LLC 发明人 ESSEGHIR, MOHAMED;COGEN, JEFFREY, M.;SENGUPTA, SAURAV, S.;DUNCHUS, NEIL, W.
分类号 C08L101/10;C09D201/10 主分类号 C08L101/10
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