| 摘要 |
PURPOSE: A substrate holding apparatus, a polishing apparatus, and a polishing method are provided to control the polishing profile of the edge part of a substrate by controlling the load of a retainer ring. CONSTITUTION: A top ring body (10) pressurizes a substrate (W) on a polishing surface. An inner retainer ring (20) surrounds the substrate. An outer retainer ring (30) surrounds the inner retainer ring. An inner compressing unit (60) pressurizes the inner retainer ring on the polishing surface of the polishing pad. An outer compressing unit (80) pressurizes the outer retainer ring on the polishing surface. |
