| 摘要 |
PURPOSE: A semiconductor package with improved testability is provided to reduce a package size or a total footprint by forming additional interface contacts on the lower surface of a semiconductor package. CONSTITUTION: An active die (102) includes interface contacts (112a,112b,112c) and exclusive test contacts (114a,114b). An interposer (104) is adjacent to the lowest surface (116a) of the active die. The interposer electrically connects the lowest surface (118a) of a package (100) and the interface contacts. The highest surface (118b) of the package and the exclusive test contacts (114a,114b) are electrically connected by a conductive medium (106a,106b). The conductive medium includes though mold vias (105a,105b) positioned in a molding (132). |
