| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module enabling a structure which is excellent in heat radiation performance to be easily and securely provided, and to provide an electric power conversion apparatus including the semiconductor module.SOLUTION: A semiconductor module 1 includes: a plate like body part 2 having a semiconductor element 21, heat sinks 22 thermally connected with the semiconductor element 21, and a sealing part 23 sealing the semiconductor element 21 and the heat sink 22 with heat radiation surfaces 221 of the heat sinks 22 exposed; coolant passage formation parts 3 forming a coolant passage 32 so as to form spaces between the coolant passage 32 and the heat radiation surfaces 221 of the heat sinks 22 of the body part 2; and joined parts 4 to which the coolant passage formation parts 3 are joined. The heat sink 22 is disposed on at least one major surface 201, 202 of the body part 2 and exposes the heat radiation surface 221 on the major surface 201, 202. Each joined part 4 is formed by a material different from the sealing part 23 of the body part 2 and is integrally molded with the sealing part 23 while being exposed to the major surface 201, 202 of the body part 2 where the heat radiation surface 221 of the heat sink 22 is exposed. |
