| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink that is inexpensively of a sheet metal structure adapted for an individual electronic component or an individual electronic apparatus with satisfactory heat radiation efficiency.SOLUTION: The heat sink using metal heat radiation plates mountable for thermal contact with an upper surface of a heat generating electronic component mounted on a printed wiring board includes: a first metal heat radiation plate having in an area other than a heat generating electronic component area a plurality of first projection portions of the same shape drawn such that top faces of truncated cones project from a surface for contact with the upper surface of the heat generating electronic component to the other surface, and provided with insertion holes for screws substantially in the center of the top faces; and a second metal heat radiation plate layered in abutment against the top faces of the first projection portions, provided with a plurality of first tapped holes in threaded engagement with the screws inserted from the insertion holes of the first projection portions, and having in an area without overlap with the first projection portions a plurality of second projection portions of the same shape as the first projection portions formed in the same direction as the first projection portions. |
