发明名称 ELECTROLESS COPPER DEPOSITION
摘要 A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is removed without removing metal seed layer on bottoms of features. An electroless deposition of metal is provided to fill the features, wherein the electroless deposition first deposits on the metal seed layer on bottoms of the features.
申请公布号 US2013203249(A1) 申请公布日期 2013.08.08
申请号 US201213364924 申请日期 2012.02.02
申请人 NALLA PRAVEEN REDDY;LAM RESEARCH CORPORATION 发明人 NALLA PRAVEEN REDDY
分类号 H01L21/768 主分类号 H01L21/768
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