发明名称 |
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME |
摘要 |
A method of mounting a semiconductor chip includes: forming a resin coating on a surface of a path connecting a bonding pad on a surface of a semiconductor chip and an electrode pad formed on a surface of an insulating base material; forming, by laser beam machining, a wiring gutter having a depth that is equal to or greater than a thickness of the resin coating along the path for connecting the bonding pad and the electrode pad; depositing a plating catalyst on a surface of the wiring gutter; removing the resin coating; and forming an electroless plating coating only at a site where the plating catalyst remains. |
申请公布号 |
US2013200522(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201313836706 |
申请日期 |
2013.03.15 |
申请人 |
PANASONIC CORPORATION;PANASONIC CORPORATION |
发明人 |
YOSHIOKA SHINGO;FUJIWARA HIROAKI |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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