| 摘要 |
PROBLEM TO BE SOLVED: To provide a configuration that can improve COP more in a binary heat pump device.SOLUTION: A heat pump device is configured by including: a lower-order-side heat pump unit 10, in which a cooling medium circulates through a compressor 11, a heat medium-cooling medium heat exchanger 12, a cascade heat exchanger 13, an expansion valve 14, and an evaporator 15, in that order; a higher-order-side heat pump unit 20, in which a cooling medium circulates through a compressor 21, a heat medium-cooling medium heat exchanger 22, an expansion valve 23, and the cascade heat exchanger 13, in that order; and a load unit 40 equipped with a flow division regulator 44, which is constructed to divide the flow of heat medium returning from the load between the lower-order-side heat medium-cooling medium heat exchanger 12 and the higher-order-side heat medium-cooling medium heat exchanger 22, and to combine and transmit to the load the divided heat medium flows that have passed through the lower-order-side heat medium-cooling medium heat exchanger 12 and the higher-order-side heat medium-cooling medium heat exchanger 22, and which regulates the amounts of the divided heat medium flows of the lower-order-side heat medium-cooling medium heat exchanger 12 and the higher-order-side heat medium-cooling medium heat exchanger 22. |
