发明名称 WIRING BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board, a light emitting device, and a manufacturing method of the wiring board which inhibit the interference between a reflection layer and a light emitting element.SOLUTION: A wiring board 1 includes: a heat sink 10; an insulation layer 20 formed on the heat sink 10; multiple wiring patterns 30 formed on the insulation layer 20 so as to be separated therefrom; and a first reflection layer 50 formed on the wiring patterns 30, exposing parts of upper surfaces 30A of the wiring patterns 30 and the insulation layer 20, and having openings 50X that will become light emitting mounting regions. Further, the wiring board 1 has a second reflection layer 60 covering the insulation layer 20 exposed from the wiring patterns 30, which are formed separated from the insulation layer 20, in the light emitting element mounting regions. The second reflection layer 60 is formed so as to be thinner than the first reflection layer 50.
申请公布号 JP2013153069(A) 申请公布日期 2013.08.08
申请号 JP20120013243 申请日期 2012.01.25
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MURAMATSU SHIGEJI;SHIMIZU HIROSHI;HORIKAWA YASUYOSHI
分类号 H01L33/48 主分类号 H01L33/48
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