MICROSTRUCTURE DEVICES WITH STRESS ISOLATION

摘要

PROBLEM TO BE SOLVED: To isolate stress sensitive microstructure devices from packaging stress and the like.SOLUTION: A bracket 102 is housed in a package housing 104, and includes a bracket base 108 with a first bracket arm 110 and a second bracket arm 112. A channel is defined between the first bracket arm 110 and the second bracket arm 112. The first bracket arm 110 defines a first mounting surface 116 facing inward with respect to the channel. The second bracket arm 112 defines a second mounting surface 118 facing outward with respect to the channel. The second mounting surface 118 of the bracket is mounted to the package housing 104. A microstructure device 106 is mounted to the first mounting surface 116 in the channel.