发明名称 GROUNDING STRUCTURES FOR HEADER AND RECEPTACLE ASSEMBLIES
摘要 <p>A receptacle assembly comprises a front housing (120) configured for mating with a header assembly, the front housing receiving a contact module therein, the contact module including a conductive holder and a frame assembly received in the conductive holder, the frame assembly comprising a plurality of contacts and a dielectric frame supporting the contacts. The front housing has a plurality of clip supports (178) at a rear (172) of the front housing, and a rib clip (300) is held by the clip supports. The rib clip includes a plurality of grounding fingers (326) which are configured to engage corresponding header shields of the header assembly, and the rib clip includes a plurality of mounting tabs (330) engaging the conductive holder to electrically connect the rib clip to the conductive holder.</p>
申请公布号 WO2013115944(A1) 申请公布日期 2013.08.08
申请号 WO2013US20607 申请日期 2013.01.08
申请人 TYCO ELECTRONICS CORPORATION 发明人 SWANGER, NATHAN WILLIAM;PICKLES, CHARLES SANDS;MINNICK, TIMOTHY ROBERT;MCCLELLAN, JUSTIN SHANE;MCCLINTON, JEFFREY BYRON;FEDDER, JAMES LEE
分类号 H01R13/6587 主分类号 H01R13/6587
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