发明名称 |
GROUNDING STRUCTURES FOR HEADER AND RECEPTACLE ASSEMBLIES |
摘要 |
<p>A receptacle assembly comprises a front housing (120) configured for mating with a header assembly, the front housing receiving a contact module therein, the contact module including a conductive holder and a frame assembly received in the conductive holder, the frame assembly comprising a plurality of contacts and a dielectric frame supporting the contacts. The front housing has a plurality of clip supports (178) at a rear (172) of the front housing, and a rib clip (300) is held by the clip supports. The rib clip includes a plurality of grounding fingers (326) which are configured to engage corresponding header shields of the header assembly, and the rib clip includes a plurality of mounting tabs (330) engaging the conductive holder to electrically connect the rib clip to the conductive holder.</p> |
申请公布号 |
WO2013115944(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
WO2013US20607 |
申请日期 |
2013.01.08 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
SWANGER, NATHAN WILLIAM;PICKLES, CHARLES SANDS;MINNICK, TIMOTHY ROBERT;MCCLELLAN, JUSTIN SHANE;MCCLINTON, JEFFREY BYRON;FEDDER, JAMES LEE |
分类号 |
H01R13/6587 |
主分类号 |
H01R13/6587 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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