| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated package by folding stack.SOLUTION: A plurality of ultracompact electronic assemblies 60 each include an ultracompact electronic element 36 arranged between substrates, and are formed by cutting a manufacturing process unit including an upper substrate and a low substrate. In another embodiment, a lead frame is joined to the substrate so that the lead protrudes from the substrate. The lead frame is joined to an additional substrate, while one or more ultracompact electronic elements are arranged between the substrates. |
