| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a polyimide film which has high dimensional stability, hardly allows oxygen and moisture to pass therethrough, thus hardly causes the deterioration of peel strength between the polyimide film and a metal layer even under high temperature and is suitable for a fine pitch circuit substrate in which a high dimensional accuracy is required, and to provide a metal laminate using the polyimide film.SOLUTION: A method for producing a polyimide film includes forming a film by adding an amino-functional siloxane of 0.1-1 wt.% to polyamic acid to form a film, and forming an SiOlayer on the surface of the film after surface treatment. The contact angle of the polyimide film to water is 10° or less. |
