发明名称 |
PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME |
摘要 |
A method of forming a semiconductor package may include providing a first package including a first semiconductor chip mounted on a first package substrate having a via-hole and molded by a first mold layer, providing a second package including a second semiconductor chip mounted on a second package substrate having a connection pad and molded by a second mold layer, stacking the first package on the second package to vertically align the via-hole with the connection pad, forming a through-hole penetrating the first and second packages and exposing the connection pad, and forming an electrical connection part in the through-hole. The electrical connection part may electrically connect the first package and the second package to each other. |
申请公布号 |
US2013200524(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201213660584 |
申请日期 |
2012.10.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HAN SEUNGCHAN;KIM HYUN-CHEOL |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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