发明名称 |
THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES |
摘要 |
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.
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申请公布号 |
US2013201615(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201213592037 |
申请日期 |
2012.08.22 |
申请人 |
ARNOLD SHAWN X.;KIDD DOUGLAS P.;MAYO SEAN A.;MULLINS SCOTT P.;PYPER DENNIS R.;THOMA JEFFREY M.;TOJIMA KENYU;APPLE INC. |
发明人 |
ARNOLD SHAWN X.;KIDD DOUGLAS P.;MAYO SEAN A.;MULLINS SCOTT P.;PYPER DENNIS R.;THOMA JEFFREY M.;TOJIMA KENYU |
分类号 |
H05K1/18;G06F1/16;H05K7/06 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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