发明名称 METHOD FOR FABRICATING SELF-ALIGNED BODY CONTACT FOR AN SEMICONDUCTOR-ON-INSULATOR TRENCH DEVICE
摘要 <p>A structure and method of forming a body contact for a semiconductor-on-insulator trench device. The method including: forming set of mandrels on a top surface of a substrate, each mandrel of the set of mandrels arranged on a different corner of a polygon and extending above the top surface of the substrate, a number of mandrels in the set of mandrels equal to a number of corners of the polygon; forming sidewall spacers on sidewalls of each mandrel of the set of mandrels, sidewalls spacers of each adjacent pair of mandrels merging with each other and forming a unbroken wall defining an opening in an interior region of the polygon, a region of the substrate exposed in the opening; etching a contact trench in the substrate in the opening; and filling the contact trench with an electrically conductive material to form the contact.</p>
申请公布号 EP2008300(B1) 申请公布日期 2013.08.07
申请号 EP20070758889 申请日期 2007.03.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DIVAKARUNI, RAMACHANDRA;CHENG, KANGGUO
分类号 H01L21/44;H01L21/00;H01L21/84;H01L27/108;H01L29/78 主分类号 H01L21/44
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