| 摘要 |
<p>In a semiconductor apparatus, a semiconductor element (70,71) is mounted on a wiring substrate (31). Wiring patterns (40) and protrusions (32) are formed on a surface of a substrate (30) with the wiring patterns (40) extending on tops of the protrusions (32). The surface of the substrate (30) on which the wiring patterns (40) are formed are covered with an insulating layer (60). Surfaces of connection parts (40c) of the wiring patterns (40) formed on the tops of the protrusions (32) are formed with the surfaces of the connection parts (40c) exposed to a surface of the insulating layer (60) on a level with the surface of the insulating layer (60) or in a position lower than the surface of the insulating layer. The connection parts (40c) are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element (70,71) is mounted by making electrical connection to the connection parts (40c) by flip chip bonding.</p> |
