发明名称 ABLATION LAYER, PHOTOSENSITIVE RESIN STRUCTURE, AND METHOD FOR PRODUCING RELIEF PRINTING PLATE USING THE PHOTOSENSITIVE RESIN STRUCTURE
摘要 Using a photosensitive resin structure having an ablation layer for a photosensitive resin for a relief printing that is capable of being processed by infrared radiation and containing an anionic polymer, a relief printing plate is produced by drawing a pattern by irradiating the ablation layer with infrared radiation; exposing the pattern by irradiating the photosensitive resin layer with ultraviolet radiation; and removing the ablation layer and unexposed photosensitive resin layer with a developer.
申请公布号 EP2381309(B1) 申请公布日期 2013.08.07
申请号 EP20090833225 申请日期 2009.12.18
申请人 ASAHI KASEI E-MATERIALS CORPORATION 发明人 ISO, CHISATO
分类号 G03F1/00;G03F7/20 主分类号 G03F1/00
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