WIRE BONDING METHOD OF ELECTRIC ELEMENT

摘要

PURPOSE: A wire bonding method for a circuit element is provided to prevent the deterioration of the adhesion of a bonding wire by removing a free air ball or a tail exposed to the air before a wire bonding process is performed again. CONSTITUTION: A light emitting device chip (30) is mounted in the cavity of a package body (2). A conveying unit (110) moves the package body to a support block (120). A heater (121) for preheating a lead frame (20) is formed on the support block. A driving part (140) moves a fixing unit (130) up and down to the fixing and releasing positions. A capillary (200) supplies a wire (201). [Reference numerals] (140) Driving part; (150) Opening detecting unit; (220) Wire supplying unit; (240) High-voltage unit; (250) FAB detecting unit; (300) Control unit; (320) Storage medium