发明名称 |
SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER |
摘要 |
A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die. |
申请公布号 |
EP2179442(A4) |
申请公布日期 |
2013.08.07 |
申请号 |
EP20080796037 |
申请日期 |
2008.06.27 |
申请人 |
SANDISK TECHNOLOGIES INC. |
发明人 |
LIAO, CHIEN-KO;CHIU, CHIN-TIEN;CHIEN, JACK, CHANG;YU, CHEEMEN;TAKIAR, HEM |
分类号 |
H01L23/04;H01L21/683;H01L23/525 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|