| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
| 摘要 |
<p>The invention relates to a photosensitive resin composition comprising a binder polymer having a (meth)acrylic acid-based structural unit, with a dispersity (weight-average molecular weight/number-average molecular weight) of no greater than 1.6, a photopolymerizable compound, a photopolymerization initiator and a sensitizing dye.</p> |
| 申请公布号 |
KR20130088166(A) |
申请公布日期 |
2013.08.07 |
| 申请号 |
KR20137015084 |
申请日期 |
2011.11.15 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MIYASAKA MASAHIRO;ENDOU MASAKI;KUSHIDA MASATAKA;MURAMATSU YUKIKO;KAJI MAKOTO |
| 分类号 |
G03F7/004;G03F7/027;G03F7/033;G03F7/26 |
主分类号 |
G03F7/004 |
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