发明名称 |
Integrated module, integrated system board, and electronic device |
摘要 |
<p>Embodiments of the present invention provide an integrated module. The integrated module includes a printed circuit board PCB and a modular device, where the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; and a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB. Positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.</p> |
申请公布号 |
EP2624668(A1) |
申请公布日期 |
2013.08.07 |
申请号 |
EP20120185847 |
申请日期 |
2012.09.25 |
申请人 |
HUAWEI DEVICE CO., LTD. |
发明人 |
DING, HAIXING;XIE, GUIFU |
分类号 |
H05K1/14;H05K1/02;H05K1/11 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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