发明名称 |
SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENT |
摘要 |
<p>A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.</p> |
申请公布号 |
EP2624673(A1) |
申请公布日期 |
2013.08.07 |
申请号 |
EP20100857881 |
申请日期 |
2010.10.01 |
申请人 |
MEIKO ELECTRONICS CO., LTD. |
发明人 |
TODA, MITSUAKI;IMAMURA, YOSHIO;HASEGAWA, TAKUYA |
分类号 |
H05K1/18;H05K1/02 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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