| 摘要 |
Provided is a hot-melt adhesive composition which can be easily applied at a relatively low temperature, has a long open time, and also has high holding power. A hot-melt adhesive composition comprising a block copolymer composition which includes a block copolymer A and a block copolymer B, and a tackifying resin, wherein a weight ratio (A/B) of the block copolymer A and the block copolymer B is 25/75 to 90/10, and an aromatic vinyl monomer unit content of the block copolymer A is 41% or greater.
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