发明名称 |
Device and method for the application of a sheet-like jointing means onto a contact area of a wafer |
摘要 |
The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces.
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申请公布号 |
US8500930(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US20050078136 |
申请日期 |
2005.03.11 |
申请人 |
THALLNER ERICH |
发明人 |
THALLNER ERICH |
分类号 |
B32B41/00;H01L21/20;H01L21/30;H01L21/58 |
主分类号 |
B32B41/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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