发明名称 |
Upper layer-forming composition and resist patterning method |
摘要 |
An upper-layer film-forming composition includes (A) a resin that is soluble in an alkaline aqueous solution, and includes a fluorine atom, and (B) a solvent component that includes (B1) a solvent having a boiling point at 101.3 kPa of 150° C. or more and a static surface tension of 23.0 mN/m or less, the upper-layer film-forming composition being used to form an upper-layer film on a photoresist film.
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申请公布号 |
US8501389(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US201113069439 |
申请日期 |
2011.03.23 |
申请人 |
KUSABIRAKI KAZUNORI;HAYAMA TAKAHIRO;SUGIE NORIHIKO;SHIMA MOTOYUKI;TANAKA KIYOSHI;JSR CORPORATION |
发明人 |
KUSABIRAKI KAZUNORI;HAYAMA TAKAHIRO;SUGIE NORIHIKO;SHIMA MOTOYUKI;TANAKA KIYOSHI |
分类号 |
G03F7/00;G03F7/004;G03F7/11 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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