| 发明名称 |
Flip chip structure and method of manufacture |
| 摘要 |
A flip chip structure includes glass stand-offs formed overlying a substrate surface. A conductive layer is formed overlying the glass stand-offs and configured for attaching to a next level of assembly. In one embodiment, photo glass processing is used to form the glass stand-offs.
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| 申请公布号 |
US8501612(B2) |
申请公布日期 |
2013.08.06 |
| 申请号 |
US20070858289 |
申请日期 |
2007.09.20 |
| 申请人 |
MORAN JOHN D.;KRUSE BLANCA;GAMEZ SANCHEZ AMILCAR B.;SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
MORAN JOHN D.;KRUSE BLANCA;GAMEZ SANCHEZ AMILCAR B. |
| 分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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