发明名称 |
Deplating contacts in an electrochemical plating apparatus |
摘要 |
An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.
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申请公布号 |
US8500968(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US20100856357 |
申请日期 |
2010.08.13 |
申请人 |
WOODRUFF DANIEL J.;ZIMMERMAN NOLAN L.;KLOCKE JOHN L.;PFEIFER KLAUS H.;HANSON KYLE M.;HERSET MATTHEW;APPLIED MATERIALS, INC. |
发明人 |
WOODRUFF DANIEL J.;ZIMMERMAN NOLAN L.;KLOCKE JOHN L.;PFEIFER KLAUS H.;HANSON KYLE M.;HERSET MATTHEW |
分类号 |
C25D17/00 |
主分类号 |
C25D17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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