| 摘要 |
PURPOSE: An epoxy resin composition is provided to have excellent reliability relative to package crack or separation because of high adhesion with metal element, and to have excellent moldability because of high flexibility and no void generation. CONSTITUTION: An epoxy resin composition comprises an epoxy resin, a curing agent, a hardening accelerator, and an inorganic filling, and a coupling agent. The coupling agent comprises polyalkyleneglycol-based alkoxysilane represented by chemical formula 1. In chemical formula 1, R1, R2, R3 and R4 are independently selected from hydrogen, a C1-10 linear or branched alkyl group, C2-10 linear or branched alkenyl group, C2-10 linear or branched alkenyl group, C2-10 linear or branched alkynyl group and C6-20 aryl group, n is an integer from 1-20, R5, R6, R7 and R8 is respectively hydrogen or C1-6 linear or branched alkyl group, and m is an integer from 1-10. |
