发明名称 |
Light-emitting diode package |
摘要 |
A light-emitting diode package is provided. The light-emitting diode package comprises a substrate and a first metal layer disposed over the substrate. A solder layer is disposed on the first metal layer and a light-emitting diode chip is disposed on the solder layer, wherein the light-emitting diode chip comprises a conductive substrate and a multilayered epitaxial structure formed on the conductive substrate, and wherein the conductive substrate is adjacent to the solder layer.
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申请公布号 |
US8502257(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US20090613003 |
申请日期 |
2009.11.05 |
申请人 |
CHANG KUO-CHING;KUO WU-CHENG;LIN TZU-HAN;VISERA TECHNOLOGIES COMPANY LIMITED |
发明人 |
CHANG KUO-CHING;KUO WU-CHENG;LIN TZU-HAN |
分类号 |
H01L27/15;H01L29/267;H01L31/0203;H01L31/12;H01L33/00 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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