发明名称 |
UBM etching methods for eliminating undercut |
摘要 |
A method includes forming an under-bump metallurgy (UBM) layer overlying a substrate, and forming a mask overlying the UBM layer. The mask covers a first portion of the UBM layer, and a second portion of the UBM layer is exposed through an opening in the mask. A metal bump is formed in the opening and on the second portion of the UBM layer. The mask is then removed. A laser removal is performed to remove a part of the first portion of the UBM layer and to form an UBM.
|
申请公布号 |
US8501613(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US201113178276 |
申请日期 |
2011.07.07 |
申请人 |
LEI YI-YANG;KUO HUNG-JUI;LIU CHUNG-SHI;LII MIRNG-JI;YU CHEN-HUA;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LEI YI-YANG;KUO HUNG-JUI;LIU CHUNG-SHI;LII MIRNG-JI;YU CHEN-HUA |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|