发明名称 |
Component built-in circuit substrate and method of producing the same |
摘要 |
A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.
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申请公布号 |
US8499998(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US20090576572 |
申请日期 |
2009.10.09 |
申请人 |
WADA YOSHIYUKI;SAKAI TADAHIKO;PANASONIC CORPORATION |
发明人 |
WADA YOSHIYUKI;SAKAI TADAHIKO |
分类号 |
B23K31/02;H01L21/70 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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