发明名称 Method of manufacturing source/drain structures
摘要 An integrated circuit device and method for manufacturing the integrated circuit device provide improved control over a shape of a trench for forming the source and drain features of integrated circuit device, by forming a second doped region in a first doped region and removing the first and the second doped regions by a first and a second wet etching processes.
申请公布号 US8501570(B2) 申请公布日期 2013.08.06
申请号 US20100981610 申请日期 2010.12.30
申请人 FANG ZIWEI;XU JEFF J.;HUANG MING-JIE;HUANG YIMIN;WU ZHIQIANG;CAO MIN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 FANG ZIWEI;XU JEFF J.;HUANG MING-JIE;HUANG YIMIN;WU ZHIQIANG;CAO MIN
分类号 H01L21/02;H01L21/265;H01L21/306;H01L29/165;H01L29/66;H01L29/78 主分类号 H01L21/02
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