发明名称 Manufacturing method of high voltage device
摘要 The present invention discloses a manufacturing method of a high voltage device. The high voltage device is formed in a first conductive type substrate. The high-voltage device includes: a second conductive type buried layer; a first conductive type high voltage well; and a second conductive type body. The high voltage well is formed by the same step for forming a first conductive type well or a first conductive type channel stop layer of a low voltage device formed in the same substrate. The body is formed by the same step for forming a second conductive type well of the low voltage device.
申请公布号 US8501567(B2) 申请公布日期 2013.08.06
申请号 US201113317568 申请日期 2011.10.21
申请人 HUANG TSUNG-YI;WANG YUH-CHYUAN;RICHTEK TECHNOLOGY CORPORATION, R.O.C. 发明人 HUANG TSUNG-YI;WANG YUH-CHYUAN
分类号 H01L21/8234 主分类号 H01L21/8234
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