发明名称 Antenna system with integrated circuit package integrated radiators
摘要 An antenna system that includes one or more radiator packages on a first side of an antenna substrate and one or more support packages on a second side of the antenna substrate are provided. Embodiments of the present invention include antenna systems incorporating a plurality of radiator packages on a first side of the antenna substrate and a plurality of support packages on the second side of the antenna substrate. The radiator packages generally include a radiator element and an integrated circuit that are incorporated into a common package. The integrated circuit of the radiator package can comprise an amplifier and/or other electronic components. The support packages generally provide one or more additional electronic components. For example, a support package integrated circuit can provide a phase shifter, amplifier, and/or other electronic components. The antenna substrate generally incorporates electrical conductors for operatively interconnecting each radiator package to at least one support package.
申请公布号 US8502735(B1) 申请公布日期 2013.08.06
申请号 US20100948401 申请日期 2010.11.17
申请人 MOOSBRUGGER PETER J.;STUTZKE NATHAN A.;ERICKSON JENNIFER L.;JOHNSON ANDREA K.;BALL AEROSPACE & TECHNOLOGIES CORP. 发明人 MOOSBRUGGER PETER J.;STUTZKE NATHAN A.;ERICKSON JENNIFER L.;JOHNSON ANDREA K.
分类号 H01Q1/38 主分类号 H01Q1/38
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