发明名称 Semiconductor device and manufacturing method thereof
摘要 An object is to improve reliability of a semiconductor device. A semiconductor device including a driver circuit portion and a display portion (also referred to as a pixel portion) over the same substrate is provided. The driver circuit portion and the display portion include thin film transistors in which a semiconductor layer includes an oxide semiconductor; a first wiring; and a second wiring. The thin film transistors each include a source electrode layer and a drain electrode layer which each have a shape whose end portions are located on an inner side than end portions of the semiconductor layer. In the thin film transistor in the driver circuit portion, the semiconductor layer is provided between a gate electrode layer and a conductive layer. The first wiring and the second wiring are electrically connected in an opening provided in a gate insulating layer through an oxide conductive layer.
申请公布号 US8502220(B2) 申请公布日期 2013.08.06
申请号 US20100848406 申请日期 2010.08.02
申请人 YAMAZAKI SHUNPEI;SAKATA JUNICHIRO;SAKAKURA MASAYUKI;OIKAWA YOSHIAKI;OKAZAKI KENICHI;MARUYAMA HOTAKA;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;SAKATA JUNICHIRO;SAKAKURA MASAYUKI;OIKAWA YOSHIAKI;OKAZAKI KENICHI;MARUYAMA HOTAKA
分类号 H01L33/40;H01L33/36;H01L33/38 主分类号 H01L33/40
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