| 摘要 |
A mounting substrate includes: a mounting area on which an electronic element is mounted; an electrode forming area on which electrodes are formed and which is formed to surround the mounting area; and a dam member which is formed on a boundary between the mounting area and the electrode forming area so as to block flow out of a filling material being filled between the electronic element and the mounting substrate, into the electrode forming area, wherein recess portions that face the electrodes are formed on an outer peripheral surface of the dam member and a part of the electrodes are formed within the recess portions.
|
