发明名称 Method for manufacturing light emitting diode
摘要 An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer formed on the substrate in sequence, the connecting layer being etchable by alkaline solution, a bottom surface of the second n-type GaN layer facing towards the connecting layer having a roughened exposed portion, the GaN on the bottom surface of the second n-type GaN layer having an N-face polarity, a blind hole extending through the p-type GaN layer, the light emitting layer and the second n-type GaN layer to expose the connecting layer, and an annular rough portion formed on the bottom surface of the second n-type GaN layer and surrounding each blind hole.
申请公布号 US8501506(B2) 申请公布日期 2013.08.06
申请号 US201113309577 申请日期 2011.12.02
申请人 HUNG TZU-CHIEN;SHEN CHIA-HUI;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 HUNG TZU-CHIEN;SHEN CHIA-HUI
分类号 H01L21/00 主分类号 H01L21/00
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