发明名称 |
Wirebondless wafer level package with plated bumps and interconnects |
摘要 |
A semiconductor package includes a carrier strip having a die cavity and bump cavities. A semiconductor die is mounted in the die cavity of the carrier strip. In one embodiment, the semiconductor die is mounted using a die attach adhesive. In one embodiment, a top surface of the first semiconductor die is approximately coplanar with a top surface of the carrier strip proximate to the die cavity. A metal layer is disposed over the carrier strip to form a package bump and a plated interconnect between the package bump and a contact pad of the first semiconductor die. An underfill material is disposed in the die cavity between the first semiconductor die and a surface of the die cavity. A passivation layer is disposed over the first semiconductor die and exposes a contact pad of the first semiconductor die. An encapsulant is disposed over the carrier strip.
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申请公布号 |
US8502376(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US201113101657 |
申请日期 |
2011.05.05 |
申请人 |
CAMACHO ZIGMUND R.;MERILO DIOSCORO A.;TAY LIONEL CHIEN HUI;CAPARAS JOSE A.;STATS CHIPPAC, LTD. |
发明人 |
CAMACHO ZIGMUND R.;MERILO DIOSCORO A.;TAY LIONEL CHIEN HUI;CAPARAS JOSE A. |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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