| 摘要 |
A thermal transfer device includes a body member having a base material of a first semiconductor material of a first type with a filler material dispersed therein of a second semiconductor material of a second type. Electrodes are attached on sides of the body member and electrical current is run therethrough to create thermal flow using the Peltier effect. The device is formed by injection molding and the like and the filler is introduced into the base by, for example, extrusion or pultrusion processes. |
